
Associate Professor
Department of Electronics and Telecommunications (DET)
- Member of Interdepartmental Center SmartData@PoliTO - Big Data and Data Science Laboratory
Profile
Research interests
Biography
Mario R. Casu received the laurea degree summa cum laude in electronics engineering and the Ph.D. degree in electronics and communications engineering from the Politecnico di Torino, Torino, Italy, in 1998 and 2001, respectively. He is currently an associate professor in the Department of Electronics and Telecommunications of the Politecnico di Torino. His current research interests are Systems-on-Chip with specialized accelerators, System-level design and design methodology for FPGAs and ASICs, Embedded Machine Learning, and Circuits and Systems for Microwave Imaging. He is also interested in the design of circuits, systems, and platforms for industrial applications (biomedical, automotive, food). His past work focused mostly on latency-insensitive design of Systems-on-Chip (SoC) and on Networks-on-Chip. In 2010-2011 he visited the system-level design research group of Prof. Luca Carloni in the department of Computer Science at Columbia University, where he worked on the design of SoC platforms with energy-efficient specialized accelerators. In 2017 he visited the Green-IC group of Prof. Massimo Alioto at the National University of Singapore (NUS) to work on the design of specialized on-chip accelerators for Machine Learning. He was involved in 9 national academic research projects (of which 2 as principal investigator), 2 European academic research projects, and 7 national and international industrial projects (of which 2 as principal investigator). He authored or co-authored more than 120 scientific papers. He regularly serves as a reviewer for peer-reviewed journals and in the technical program committee of international conferences (among which DAC, ICCAD, DATE).
Scientific branch
(Area 0009 - Industrial and information engineering)
Research topics
- Embedded Machine Learning - Heterogeneous Embedded Systems (ASIC, FPGA, CPU, GPU) for an optimized execution of ML algorithms (ML); - Design of embedded ML systems for biomedical and industrial applications.
- Microwave Imaging (MI) - Circuits and systems for generating, acquiring, and processing of signals used in MI for biomedical applications (breast cancer and stroke detection) and industrial applications (detection and classification of contaminants in packaged food).
- System-on-Chip (SoC) - Latency-Insensitive Design to make SoC tolerant to interconnect delays; - Network-on-Chip design to efficiently interconnect SoC components (processord, accelerators, and memories); - SoC design starting from a high-level description; - Optimization of SoC implemented in FPGAs; - Electronic Design Automation (EDA) for SoC design.
- Ultra-Wide Band (UWB) - Mixed-signal integrated circuits for UWB transmitters and receivers; - UWB circuits and systems for biomedical applications: breast cancer detection
Skills
ERC sectors
SDG
Editorial boards
- IEEE TRANSACTIONS ON AGRIFOOD ELECTRONICS. (2022-), Associate Editor of magazine or editorial series
Conferences
- Design, Automation and Test in Europe (DATE) Conference, Program committee
- IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) (11/11/2022-13/11/2022), Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), Program committee
- Design, Automation and Test in Europe (DATE) Conference, Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), Program committee
- Design, Automation and Test in Europe (DATE) Conference, Program committee
- International Conference on Computer-Aided Design (ICCAD), Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- Design, Automation and Test in Europe (DATE) Conference, Program committee
- International Conference on Computer-Aided Design (ICCAD), Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- International Symposium on Networks-on-Chip, Participation to the organizing committee
- International Conference on Computer-Aided Design (ICCAD), Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- International Symposium on Networks-on-Chip, Participation to the organizing committee
- Design Automation Conference (DAC), Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- Design Automation Conference (DAC), Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- Design Automation Conference (DAC), Program committee
- IEEE Nordic Circuits and Systems Conference (NORCAS), Program committee
- International Symposium on System-on-Chip (SoC), Program committee
- International Symposium on System-on-Chip (SoC), Program committee
- International Workshop on Formal Methods for Globally Asynchronous Locally Synchronous Design (FMGALS), Program committee
Other research or teaching roles outside Politecnico
- Visiting Researcher, presso National University of Singapore (1/5/2017-31/8/2017)
- Visiting Professor, presso Chongqing Technology and Business University (27/6/2016-4/7/2016)
- Visiting Researcher, presso Columbia University (15/11/2010-15/3/2011)
- Visiting Researcher, presso CEA Grenoble (1/4/2001-30/9/2001)
Other titles
- Honorary chair professor at the Chongqing Technology and Business University, China (2017-2019)
Roles as evaluator or expert
- Bando per la Creazione e lo Sviluppo di Unità di Ricerca. 2015
REGIONE AUTONOMA VALLE D'AOSTA - ASSESSORATO ATTIVITA' PRODUTTIVE - DIPARTIMENTO INDUSTRIA, ARTIGIANATO ED ENERGIA - RICERCA, INNOVAZIONE E QUALITA' - Bando a favore di imprese industriali per la realizzazione di progetti di ricerca e sviluppo negli ambiti della Smart Specialisation Strategy (S3) della Valle d’Aosta. 2018
REGIONE AUTONOMA VALLE D'AOSTA - ASSESSORATO ATTIVITA' PRODUTTIVE - DIPARTIMENTO INDUSTRIA, ARTIGIANATO ED ENERGIA - RICERCA, INNOVAZIONE E QUALITA' - Bando “Aggregazioni R&S”. 2021
REGIONE AUTONOMA VALLE D'AOSTA - ASSESSORATO ATTIVITA' PRODUTTIVE - DIPARTIMENTO INDUSTRIA, ARTIGIANATO ED ENERGIA - RICERCA, INNOVAZIONE E QUALITA' - Bando a favore di imprese industriali per la realizzazione di progetti di ricerca e sviluppo negli ambiti della Smart Specialisation Strategy (S3) della Valle d’Aosta. 2019
FINAOSTA S.P.A.
Teaching
Courses of Study Boards
Teachings
Master of Science
- Edge Computing Systems for AI and ML. A.A. 2023/24, MECHATRONIC ENGINEERING (INGEGNERIA MECCATRONICA). Collaboratore del corso
- Integrated systems technology. A.A. 2017/18, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Integrated systems technology. A.A. 2018/19, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Integrated systems technology. A.A. 2019/20, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Integrated systems technology. A.A. 2020/21, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Integrated systems technology. A.A. 2021/22, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Integrated systems technology. A.A. 2022/23, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Integrated systems technology. A.A. 2023/24, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Microelettronica digitale. A.A. 2017/18, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Collaboratore del corso
- Microelettronica digitale. A.A. 2018/19, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Titolare del corso
- Microelettronica digitale. A.A. 2019/20, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Titolare del corso
- Microelettronica digitale. A.A. 2020/21, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Titolare del corso
- Microelettronica digitale. A.A. 2021/22, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Titolare del corso
- Microelettronica digitale. A.A. 2022/23, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Titolare del corso
- Microelettronica digitale. A.A. 2023/24, INGEGNERIA ELETTRONICA (ELECTRONIC ENGINEERING). Titolare del corso
- Switching technologies for data centers. A.A. 2017/18, COMMUNICATIONS AND COMPUTER NETWORKS ENGINEERING (INGEGNERIA TELEMATICA E DELLE COMUNICAZIONI). Collaboratore del corso
- Embedded Electronic Systems for AI/ML. A.A. 2020/21, MECHATRONIC ENGINEERING (INGEGNERIA MECCATRONICA). Collaboratore del corso
- Embedded Electronic Systems for AI/ML. A.A. 2021/22, MECHATRONIC ENGINEERING (INGEGNERIA MECCATRONICA). Collaboratore del corso
- Embedded Electronic Systems for AI/ML. A.A. 2022/23, MECHATRONIC ENGINEERING (INGEGNERIA MECCATRONICA). Collaboratore del corso
- Programmable electronic systems. A.A. 2017/18, COMMUNICATIONS AND COMPUTER NETWORKS ENGINEERING (INGEGNERIA TELEMATICA E DELLE COMUNICAZIONI). Titolare del corso
Bachelor of Science
- Elettronica applicata e misure. A.A. 2017/18, INGEGNERIA INFORMATICA. Titolare del corso
- Elettronica applicata. A.A. 2017/18, INGEGNERIA INFORMATICA. Titolare del corso
- Elettronica applicata. A.A. 2018/19, INGEGNERIA INFORMATICA. Titolare del corso
- Elettronica applicata. A.A. 2019/20, INGEGNERIA INFORMATICA. Titolare del corso
- Elettronica applicata. A.A. 2020/21, INGEGNERIA INFORMATICA. Titolare del corso
- Elettronica applicata. A.A. 2021/22, INGEGNERIA INFORMATICA. Titolare del corso
- Elettronica applicata. A.A. 2022/23, INGEGNERIA INFORMATICA. Titolare del corso
- Elettronica applicata. A.A. 2023/24, INGEGNERIA INFORMATICA. Titolare del corso
Teaching and training projects
Projects funded by competitive calls
- Building a Digitally-Supported Education Ecosystem for Next Generation Microelectronics Experts in Sustainable Chips and Applications for a Green and Circular Economy, (2023-2027) - Responsabile Scientifico
University cooperation
Research
Research fields
Research groups
Research projects
Projects funded by competitive calls
- CONSORTIUM AGREEMENT EUROSOI - THEMATIC NETWORK ON SILICON ON INSULATOR TECHNOLOGY DEVICES AND CIRCUITS , (periodo sconosciuto) - Responsabile Scientifico
UE-funded research - GreenFactory4Compo - Green Factory for Composites , (2016-2019) - Responsabile Scientifico
Regionally funded research - Piattaforme Tecnologiche
Projects funded by commercial contracts
- TRATTAMENTO SEGNALI AUDIO AES/EBU PER MATRICE DI COMMUTAZIONE BASATA SU FPGA ESTENSIONE CONTRATTO 401/2008 , (2009-2009) - Responsabile Scientifico
Commercial Research - TRATTAMENTO DI SEGNALI AUDIO AES/EBU PER MATRICE DI COMMUTAZIONE BASATA SUL FPGA , (2008-2009) - Responsabile Scientifico
Commercial Research
Supervised PhD students
- Lorenzo Lagostina. Programme in Ingegneria Elettrica, Elettronica E Delle Comunicazioni (39th cycle, 2023-in progress)
- Edward Manca. Programme in Ingegneria Elettrica, Elettronica E Delle Comunicazioni (39th cycle, 2023-in progress)
- Teodoro Urso. Programme in Ingegneria Elettrica, Elettronica E Delle Comunicazioni (38th cycle, 2022-in progress)
- Fabrizio Ottati. Programme in Ingegneria Elettrica, Elettronica E Delle Comunicazioni (36th cycle, 2020-in progress)
Big Data, Machine Learning, Neural Networks and Data Science Micro- and nanotechnologies, devices, systems and applications VLSI theory, design and applications Big Data, Machine Learning, Neural Networks and Data Science Micro- and nanotechnologies, devices, systems and applications VLSI theory, design and applications - Luca Urbinati. Programme in Ingegneria Elettrica, Elettronica E Delle Comunicazioni (36th cycle, 2020-in progress)
Research subject: Embedded Machine Learning
Big Data, Machine Learning, Neural Networks and Data Science VLSI theory, design and applications Big Data, Machine Learning, Neural Networks and Data Science VLSI theory, design and applications - Mohammadamir Mansoori. Programme in Ingegneria Elettrica, Elettronica E Delle Comunicazioni (34th cycle, 2018-2022)
Thesis: FPGA Acceleration of Domain-specific Kernels via High-Level Synthesis - Vittorio Mazzia. Programme in Ingegneria Elettrica, Elettronica E Delle Comunicazioni (34th cycle, 2018-2022)
Thesis: Machine Learning Algorithms and their Embedded Implementation for Service Robotics Applications
Big Data, Machine Learning, Neural Networks and Data Science Mechatronics and robotics Big Data, Machine Learning, Neural Networks and Data Science Mechatronics and robotics
Publications
Latest publications View all publications in Porto@Iris
- Ottati, Fabrizio; Gao, Chang; Chen, Qinyu; Brignone, Giovanni; Casu, Mario Roberto; ... (2023)
To Spike or Not To Spike: A Digital Hardware Perspective on Deep Learning Acceleration. In: IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS. ISSN 2156-3365
Contributo su Rivista - Darwish, A.; Ricci, M.; Zidane, F.; Tobon Vasquez, J. A.; Casu, M. R.; Lanteri, J.; ... (2023)
In-Line Microwave Nondestructive Evaluation of Packaged Food Products via the Support Vector Machine Algorithm. In: 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA, 23-28 July 2023, pp. 343-344. ISSN 1522-3965. ISBN: 978-1-6654-4228-2
Contributo in Atti di Convegno (Proceeding) - Ricci, M.; Vasquez, J. A. T.; Scapaticci, R.; Turvani, G.; Casu, M. R.; Crocco, L.; ... (2023)
Preliminary In-Line Microwave Imaging Experimental Assessment for Food Contamination Monitoring. In: 17th European Conference on Antennas and Propagation, EuCAP 2023, Florence, Italy, 26-31 March 2023, pp. 1-3. ISBN: 978-1-6654-7541-9
Contributo in Atti di Convegno (Proceeding) - Rodriguez-Duarte, D. O.; Origlia, C.; Tobon Vasquez, J. A.; Scapaticci, R.; Turvani, G.; ... (2023)
A low-complexity microwave scanner for cerebrovascular diseases monitoring. In: 2023 XXXVth URSI General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS), Sapporo, Japan, August 19 - 26, 2023
Contributo in Atti di Convegno (Proceeding) - Tobon Vasquez, J. A.; Rodriguez-Duarte, D. O.; Origlia, C.; Turvani, G.; Scapaticci, R.; ... (2022)
Microwave imaging device prototype for brain stroke 3D monitoring. In: 2022 International Workshop on Antenna Technology (iWAT), Dublin, Ireland, 16-18 May 2022, pp. 200-202. ISBN: 978-1-6654-9449-6
Contributo in Atti di Convegno (Proceeding)
Society and Enterprise
Patents and other intellectual properties
- MIx&Latch: a method to increase the operating frequency of synchronous digital circuits using a single clock tree and a mixed distribution of sequential elements. national Patent
Inventors: Mario Roberto Casu Luciano Lavagno Filippo Minnella - DISPOSITIVO DI IMAGING A MICROONDE PER IL MONITORAGGIO DI DEVIAZIONI DIELETTRICHE IN UN MEZZO. national and international Patent
Inventors: Mario Roberto Casu Jorge Alberto Tobon Vasquez Giovanna Turvani Francesca Vipiana