Francesco Iannuzzo

• Reliability assessment and enhancement of power electronic components

ERC sectors

SDG

• Steering Committe member - IEEE Power Electronics Society (PELS), Stati Uniti (2024-2026)
• Fellow - IEEE - Institute of Electrical and Electronics Engineers, Stati Uniti (2012-)
  IEEE Senior Member
• Effective member - IEEE - Institute of Electrical and Electronics Engineers, Stati Uniti (2004-)

• POWER ELECTRONIC DEVICES AND COMPONENTS (2022-), Director

• ESREF - European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Program chair
• ESREF - European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Program chair

• Professore a contratto, presso Università degli Studi di PARMA (22/2/2021-30/3/2022)
• Attivita' di insegnamento (art. 23 L. 240/10), presso Università degli Studi di PARMA (22/2/2021-30/3/2022)

• TECNOLOGIE DELL'INFORMAZIONE, 2023/2024 (39. ciclo)
  Università degli Studi di PARMA
• TECNOLOGIE DELL'INFORMAZIONE, 2022/2023 (38. ciclo)
  Università degli Studi di PARMA
• TECNOLOGIE DELL'INFORMAZIONE, 2021/2022 (37. ciclo)
  Università degli Studi di PARMA
• TECNOLOGIE DELL'INFORMAZIONE, 2020/2021 (36. ciclo)
  Università degli Studi di PARMA

• Collegio di Ingegneria Elettrica ed Energetica. Componente
• Collegio di Ingegneria Informatica, del Cinema e Meccatronica. Componente invitato

PhD

• Reliability of Power Electronics Devices. A.A. 2025/26, INGEGNERIA ELETTRICA, ELETTRONICA E DELLE COMUNICAZIONI. Main teacher
• Reliability of Power Electronics Devices. A.A. 2024/25, INGEGNERIA ELETTRICA, ELETTRONICA E DELLE COMUNICAZIONI. Main teacher

Master of Science

• Elettronica di potenza per l'energia. A.A. 2025/26, INGEGNERIA ELETTRICA. Collaboratore del corso
• Electrical Technologies for eMobility. A.A. 2025/26, MECHATRONIC ENGINEERING (INGEGNERIA MECCATRONICA). Collaboratore del corso
• Electrical conversion from green sources of energy. A.A. 2025/26, INGEGNERIA ENERGETICA E NUCLEARE. Collaboratore del corso
• Hybrid and electric propulsion systems. A.A. 2025/26, INGEGNERIA MECCANICA (MECHANICAL ENGINEERING). Collaboratore del corso
• Battery assembly, BMS and modeling. A.A. 2025/26, INGEGNERIA ENERGETICA E NUCLEARE. Titolare del corso
• Elettronica di potenza per l'energia. A.A. 2024/25, INGEGNERIA ELETTRICA. Collaboratore del corso
• Electrical Technologies for eMobility. A.A. 2024/25, MECHATRONIC ENGINEERING (INGEGNERIA MECCATRONICA). Collaboratore del corso

Bachelor of Science

• Sistemi di propulsione elettrica per i trasporti. A.A. 2025/26, INGEGNERIA ELETTRICA. Collaboratore del corso
• Sistemi di propulsione elettrica per i trasporti. A.A. 2024/25, INGEGNERIA ELETTRICA. Collaboratore del corso

Projects funded by commercial contracts

• Contratto Ricerca (attuativo Accordo di Partnership ID n. 695/2024) “SPEA S.p.A.” - Resp. Prof. Francesco Iannuzzo e (coinvolgimento del DISAT) relativo al progetto “Ottimizzazione ai fini competitivi delle loro apparecchiature Power Device Tester (PDT) di test dei componenti elettronici di potenza”, (2025-2026) - Responsabile Scientifico
  Commercial Research

• Cerutti, Stefano; Iannuzzo, Francesco; Sangwongwanich, Ariya; Kerekes, Tamas; Pavone, ... (2025)
  Reliability-Constrained Design of a High-Gain Power Optimizer based on a Real Mission Profile. In: 2025 IEEE Applied Power Electronics Conference and Exposition (APEC), Atlanta (USA), 16-20 marzo 2025, pp. 738-745. ISBN: 979-8-3315-1611-6
  Contributo in Atti di Convegno (Proceeding)
• Zarghani, Mostafa; Iannuzzo, Francesco; Blaabjerg, Frede; Kaboli, Shahriyar (2024)
  A Distributed Turn-Off Delay Compensator Scheme for Voltage Balancing of Series-Connected IGBTs. In: IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, vol. 12, pp. 2545-2557. ISSN 2168-6777
  Contributo su Rivista
• Yao, Ran; Zhu, Zheyan; Li, Hui; Lai, Wei; Chen, Xianping; Iannuzzo, Francesco; Liu, ... (2024)
  A Double-Sided Cooling Approach of Discrete SiC MOSFET Device Based on Press-Pack Package. In: IEEE OPEN JOURNAL OF POWER ELECTRONICS, vol. 5, pp. 1629-1640. ISSN 2644-1314
  Contributo su Rivista
• Zhan, Cao; Wang, Weicheng; Tang, Yizheng; Li, Yixin; Iannuzzo, Francesco; Zhu, Lingyu; ... (2024)
  A Novel Sensor-Reduction Condition Monitoring Approach for MMC Submodule IGBTs Based on Statistics of Inferred On-State Voltage. In: IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, vol. 12, pp. 1068-1077. ISSN 2168-6777
  Contributo su Rivista
• Zhang, Kaichen; Iannuzzo, Francesco; Blaabjerg, Frede (2024)
  Application-Oriented Flexible Power Cycling Test System for Power Electronic Components. In: IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, vol. 12, pp. 5805-5816. ISSN 2168-6777
  Contributo su Rivista
• Zhang, Kaichen; Iannuzzo, Francesco; Blaabjerg, Frede (2024)
  Comparative Analysis of Bond Wire Degradation in Power Modules during DC and AC Power Cycling. In: 2024 IEEE 15th International Symposium on Power Electronics for Distributed Generation Systems, PEDG 2024, 23/06/2024 - 26/06/2024
  Contributo in Atti di Convegno (Proceeding)
• Zhang, Yi; Zhang, Yichi; Hon Wong, Voon; Kalker, Sven; Caruso, Antonio; Ruppert, Lukas; ... (2024)
  Figures-of-Merit Study for Thermal Transient Measurement of SiC MOSFETs. In: IEEE TRANSACTIONS ON POWER ELECTRONICS, vol. 39, pp. 11583-11595. ISSN 0885-8993
  Contributo su Rivista
• Lu, Zhebie; Iannuzzo, Francesco (2024)
  In-Operation Junction Temperature Extraction for Cascode GaN Devices Based on Turn-Off Delay. In: IEEE TRANSACTIONS ON POWER ELECTRONICS, vol. 39, pp. 4735-4745. ISSN 0885-8993
  Contributo su Rivista
• Zhan, Cao; Tang, Yizheng; Zhu, Lingyu; Wang, Weicheng; Gou, Yating; Ji, Shengchang; ... (2024)
  Intelligent Condition Monitoring of Multiple Thermal Degradation of IGBT Modules Based on Case Temperature Matrix. In: IEEE TRANSACTIONS ON POWER ELECTRONICS, vol. 39, pp. 12490-12501. ISSN 0885-8993
  Contributo su Rivista
• Zhan, Cao; Zhu, Lingyu; Zhang, Yaxin; Ji, Shengchang; Iannuzzo, Francesco; Blaabjerg, ... (2024)
  Investigation on Saturation Voltage Increment of Multichip Press-Pack IGBTs Under Power Cycling Tests. In: IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, vol. 71, pp. 15012-15023. ISSN 0278-0046
  Contributo su Rivista
• Iannuzzo, Francesco (2024)
  Large-Scale Adoption of Silicon Carbide in the Automotive Sector: What is Missing?. In: CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems, Dusseldorf (Germany), 12/03/2024 - 14/03/2024, pp. 678-683
  Contributo in Atti di Convegno (Proceeding)
• Yu, Xinming; Iannuzzo, Francesco; Zhou, Dao (2024)
  Model-Based Thermal Stress and Lifetime Estimation of DFIG Wind Power Converter. In: ENERGIES, vol. 17. ISSN 1996-1073
  Contributo su Rivista
• Lu, Zhebie; Iannuzzo, Francesco (2024)
  Online Junction Temperature Extraction for Cascode GaN Devices Based on Turn-On Delay. In: IEEE TRANSACTIONS ON POWER ELECTRONICS, vol. 39, pp. 10250-10260. ISSN 0885-8993
  Contributo su Rivista
• Baker, Nick; Dupont, Laurent; Michal Beczkowski, Szymon; Iannuzzo, Francesco (2024)
  Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs. In: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. PART C. MANUFACTURING, vol. 14. ISSN 1083-4400
  Contributo su Rivista
• Lu, Zhebie; Iannuzzo, Francesco (2023)
  Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling. In: MICROELECTRONICS RELIABILITY, vol. 150. ISSN 0026-2714
  Contributo su Rivista
• Zhu, Ankang; Ye, Shuoyu; Kang, Jianlong; Xin, Zhen; Luo, Haoze; Iannuzzo, Francesco; Li, ... (2023)
  Analytical Modeling and Sensitivity Analysis on Plasma Extraction Transit Time (PETT) Oscillations in High-Voltage NPT p-i-n Diode. In: IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, vol. 11, pp. 1754-1766. ISSN 2168-6777
  Contributo su Rivista
• Zhang, Kaichen; Leduc, Charles; Iannuzzo, Francesco (2023)
  Comparison of Junction Temperature Measurement Using the TSEP Method and Optical Fiber Method in IGBT Power Modules without Silicone Gel Removal. In: PCIM Europe 2023 : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg (Germany), 09/05/2023 - 11/05/2023
  Contributo in Atti di Convegno (Proceeding)
• Lu, Zhebie; Iannuzzo, Francesco (2023)
  Design of a Non-destructive Device Test Platform Capable of Double-pulse Tests and Short-circuit Tests with Fast Overcurrent Protection for Wide Band-gap Devices. In: 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe, Aalborg (Denmark), 04/09/2023 - 08/09/2023
  Contributo in Atti di Convegno (Proceeding)
• Valeriu Pirosca, Adrian; Vecchio, Marcello; Agatino Rizzo, Santi; Iannuzzo, Francesco (2023)
  Evaluation of the Thermal Resistance in GaN HEMTs Using Thermo-Sensitive Electrical Parameters. In: ENERGIES, vol. 16. ISSN 1996-1073
  Contributo su Rivista
• Lu, Zhebie; Iannuzzo, Francesco (2023)
  Factors Affecting Self-Sustained Switching Oscillations of Cascode GaN Devices and Mitigation Strategy during Parameter Design. In: APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition, Orlando (United States), 19/03/2023 - 23/03/2023, pp. 632-636
  Contributo in Atti di Convegno (Proceeding)
• Oliveira, J.; Frey, P.; Morel, H.; Reynes, J. M.; Burky, J.; Coccetti, F.; Iannuzzo, F.; ... (2023)
  Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions. In: MICROELECTRONICS RELIABILITY, vol. 148. ISSN 0026-2714
  Contributo su Rivista
• Xue, Peng; Iannuzzo, Francesco (2023)
  Ferrite Beads Design to Improve Turn-off Characteristics of Cascode GaN HEMTs: An Optimum Design Method. In: IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, vol. 11, pp. 3184-3194. ISSN 2168-6777
  Contributo su Rivista
• Zhan, Cao; Zhang, Yaxin; Tang, Yizheng; Iannuzzo, Francesco; Zhu, Lingyu; Ji, ... (2023)
  Influence of Temperature on Bond Wire Fatigue of Gate Loops in IGBT Modules under Sinusoidal Vibration Stress. In: ICPE 2023-ECCE Asia - 11th International Conference on Power Electronics - ECCE Asia : Green World with Power Electronics, Jeju (Korea, Republic of), 22/05/2023 - 25/05/2023, pp. 1349-1354
  Contributo in Atti di Convegno (Proceeding)
• Zhang, Kaichen; Sajjad Bahman, Amir; Iannuzzo, Francesco; Ramesh Chopade, Amol; Holst, ... (2023)
  Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions. In: MICROELECTRONICS RELIABILITY, vol. 150. ISSN 0026-2714
  Contributo su Rivista
• Liu, Renkuan; Li, Hui; Yao, Ran; Lai, Wei; Duan, Zeyu; Iannuzzo, Francesco (2023)
  Investigation on the Short-circuit Withstand Capability of Press-pack IGBT modules with Optimized Package Structures. In: 2023 24th International Vacuum Electronics Conference, IVEC 2023, Chengdu (China), 25/04/2023 - 28/04/2023
  Contributo in Atti di Convegno (Proceeding)
• Lu, Zhebie; Iannuzzo, Francesco (2023)
  Junction temperature monitoring for cascode GaN devices using the Si MOSFET's body diode voltage drop. In: MICROELECTRONICS RELIABILITY, vol. 150. ISSN 0026-2714
  Contributo su Rivista
• Yao, Ran; Duan, Zeyu; Li, Hui; Iannuzzo, Francesco; Lai, Wei; Chen, Xianping (2023)
  Lifetime prediction for press pack IGBT device by considering fretting wear failure. In: MICROELECTRONICS RELIABILITY, vol. 145. ISSN 0026-2714
  Contributo su Rivista
• Philipps, Daniel A.; Xue, Peng; Ubostad, Tobias N.; Iannuzzo, Francesco; Peftitsis, ... (2023)
  Low Inductive Characterization of Fast-Switching SiC MOSFETs and Active Gate Driver Units. In: IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, vol. 59, pp. 6384-6398. ISSN 0093-9994
  Contributo su Rivista
• Zhan, Cao; Zhu, Lingyu; Wang, Weicheng; Zhang, Yaxin; Ji, Shengchang; Iannuzzo, Francesco (2023)
  Multidimensional Mission-Profile-Based Lifetime Estimation Approach for IGBT Modules in MMC-HVdc Application Considering Bidirectional Power Transfer. In: IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, vol. 70, pp. 7290-7300. ISSN 0278-0046
  Contributo su Rivista
• Baker, Nick; Lemmon, Andy; Iannuzzo, Francesco; Michal Beczkowski, Szymon; Austin, John; ... (2023)
  Temperature Monitoring of Multi-Chip SiC MOSFET Modules: On-Chip RTDs vs. VSD(T). In: 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe, Aalborg (Denmark), 04/09/2023 - 08/09/2023
  Contributo in Atti di Convegno (Proceeding)
• Mdanat, Rand A. L.; Saeed, Sarah; Georgious, Ramy; Garcia, Jorge; Iannuzzo, Francesco (2023)
  Optimization of a Bidirectional Boost Converter for Nanogrid Applications. In: 2023 IEEE Industry Applications Society Annual Meeting, IAS 2023, Nashville (United States), 29/10/2023 - 02/11/2023
  Contributo in Atti di Convegno (Proceeding)
• Zhang, Kaichen; Iannuzzo, Francesco; Holm Christiansen, Christian (2023)
  Reliability of WBG, results of a Pre-Scoping Study. In: 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe, Aalborg (Denmark), 04/09/2023 - 08/09/2023
  Contributo in Atti di Convegno (Proceeding)
• Yu, Yue; Li, Hui; Yao, Ran; Iannuzzo, Francesco; Zhu, Zheyan; Chen, Xianping (2023)
  Short-Circuit Capability Optimization of Press-Pack IGBT by Improving Active Edge Heat Dissipation. In: IEEE TRANSACTIONS ON POWER ELECTRONICS, vol. 38, pp. 6143-6156. ISSN 0885-8993
  Contributo su Rivista
• Wang, Qiang; Zhang, Jingwei; Iannuzzo, Francesco; Jiang, Yizhan; Zhang, Weifeng; He, ... (2023)
  Short-Circuit Fault Adaptive Analysis and Protection for SiC MOSFETs. In: IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, vol. 11, pp. 4867-4881. ISSN 2168-6777
  Contributo su Rivista
• Sun, Zhongchao; Bjorn Jorgensen, Asger; Baker, Nick; Beczkowski, Szymon; Guo, Wendi; ... (2023)
  Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors. In: APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition, Orlando (United States), 19/03/2023 - 23/03/2023, pp. 1135-1140
  Contributo in Atti di Convegno (Proceeding)
• Zhang, Kaichen; Iannuzzo, Francesco (2023)
  Thermal Mapping of Power Modules Using Optical Fibers during AC Power Cycling Tests. In: APEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition, Orlando (United States), 19/03/2023 - 23/03/2023, pp. 2630-2633
  Contributo in Atti di Convegno (Proceeding)
• Yu, Xinming; Iannuzzo, Francesco; Zhou, Dao (2023)
  Thermal Stress Emulation of Power Devices Subject to DFIG Wind Power Converter. In: PEDG 2023 - 2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems, Shanghai (China), 09/06/2023 - 12/06/2023, pp. 141-147
  Contributo in Atti di Convegno (Proceeding)