Ph.D. candidate in Ingegneria Elettrica, Elettronica E Delle Comunicazioni , 41st cycle (2025-2028)
Department of Energy (DENERG)
Profile
PhD
Research topic
Characterization of Automotive-class Wide Bandgap Semiconductors and Modular Packaging Design
Tutors
Research presentation
Keywords
Biography
Research Objectives:
2.1 Characterization Under Abnormal and Fault Conditions:
• Develop experimental setups to evaluate SiC and GaN devices under Short circuit and avalanche stress
• Identify degradation signatures, precursors to failure, and catastrophic failure modes.
• Create physics-based models linking stress conditions to long-term Objectives reliability.
2.2 Reliability-Oriented Packaging Innovation:
Investigate advanced packaging materials and architectures (including: Advanced additive manufacturing, including mixed metal/insulator 3D printing, Low inductance module layouts, Double-sided cooling structures and High frequency optimized interconnects)
• Assess thermo-mechanical robustness under automotive mission profiles (thermal cycling, vibration, humidity, power cycling).
• Explore embedded sensing or monitoring features for predictive maintenance.
2.3 Co-Design of Device, Package, and System:
• Develop multi-physics simulation frameworks combining electrical, thermal, and mechanical domains.
• Optimize module design for: Fast switching,EMI mitigation,Thermal spreading and Fault tolerance
• Validate optimized designs through prototype fabrication and accelerated stress testing