Chiara Spano

Titolo della tesi

Innovative Semiconductor Package Technology for Power Module Applications

Tutori

• Luciano Scaltrito
• Candido Pirri

• Spano, Chiara; Galfre', Giulio; Mattiuzzo, Emilio; D'Ancona, Lorenzo; Bertana, ... (2024)
  Evaluation of the Thermal Fatigue and Failure Mechanisms on Power Modules with Different Types of Substrates (DBC / IMS). In: CIPS 2024 Düsseldorf: a dynamic fusion of keynotes, invited Speakers and exhibitions in power electronics system integration, Düsseldorf (Germany), March 12-14, 2024, pp. 103-109. ISBN: 9783800762880
  Contributo in Atti di Convegno (Proceeding)
• Arduino, Daniele; Stassi, Stefano; Spano, Chiara; Scaltrito, Luciano; Ferrero, Sergio; ... (2023)
  Silicon and Silicon Carbide Recrystallization by Laser Annealing: A Review. In: MATERIALS, vol. 16. ISSN 1996-1944
  Contributo su Rivista
• Galfre', Giulio; Spano, Chiara; Aufiero, Paolo; Bertana, Valentina; Ferrero, Sergio; ... (2023)
  Influence of Materials and Packaging Solutions on Thermal Behaviour of Power Modules. In: COMSOL Conference 2023, Munich (Germany), 25-27 October 2023. ISBN: 978-1-7364524-1-7
  Contributo in Atti di Convegno (Proceeding)